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December 2006
Immersion Lithography
December 2006In several times, Intel says that the 45 nm process technology will attend in 2007. At IEDM (International Electron Device Meeting), IBM And AMD explain the three technology which expected will be able to compete with the development of Intel 45nm process production, there is use of immersion lithography, whereabouts AMD say that the think will improve the ability of microprocessor design, and production mount consistency.
Like the use of interconnection dielectric ultra-low-K to increase performance comparison with energy requirement (watt) and the increase of transistor stress reduction technique.
Process technology which existing in this time is still uses the conventional lithography. Whereabouts have enough significant limitation to design smaller than 65 nm. And the Immersion Lithography is use the lens projection which loaded by purified water, as step by step part of Lithography.
Through Immersion Lithography will improve the light stream, deep of focus and depiction clarity, whereabouts this matter also will improve the efficiency of chip process. For example, 15 percent improvement performance from a SRAM cell, because of the increase ability of production process.
Process technology which existing in this time is still uses the conventional lithography. Whereabouts have enough significant limitation to design smaller than 65 nm. And the Immersion Lithography is use the lens projection which loaded by purified water, as step by step part of Lithography.
Through Immersion Lithography will improve the light stream, deep of focus and depiction clarity, whereabouts this matter also will improve the efficiency of chip process. For example, 15 percent improvement performance from a SRAM cell, because of the increase ability of production process.
Labels: techno
